Copper(II) Hybrid Nanoflower-Supported Carbon Nanotubes on Copper Foil for Dye-Sensitized Solar Cells


DAYAN S., ÖZDEMİR N., Akbulut M., Kalaycıoğlu Özpozan N.

Journal of Electronic Materials, cilt.51, sa.10, ss.5965-5975, 2022 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 51 Sayı: 10
  • Basım Tarihi: 2022
  • Doi Numarası: 10.1007/s11664-022-09781-7
  • Dergi Adı: Journal of Electronic Materials
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, PASCAL, Applied Science & Technology Source, Chemical Abstracts Core, Chimica, Compendex, Computer & Applied Sciences, INSPEC
  • Sayfa Sayıları: ss.5965-5975
  • Anahtar Kelimeler: Hybrid nanoflowers, copper foil, DSSC, counter electrode, COUNTER ELECTRODE, PERFORMANCE IMPROVEMENT, CATALYTIC-ACTIVITY, EFFICIENCY, FABRICATION, NANOMATERIALS, COMPLEXES, SURFACE
  • Kayseri Üniversitesi Adresli: Hayır

Özet

© 2022, The Minerals, Metals & Materials Society.Here, modified flower-like hybrid nanomaterials (Nfs) on copper foil (CFS) were successfully fabricated and tested as counter electrodes (Pt-free) in dye-sensitized solar cells (DSSCs). The copper foil was activated and modified with phosphate ions to form a flower-like hybrid nanomaterial on the copper foil surface [Cu(II)Nfs@CFS], and multi-walled carbon nanotubes (MWCNTs) were then immobilized on the structure [Cu(II)Nfs/MWCNTs@CFS] in order to strengthen the photovoltaic parameters. As expected, a significant difference in performance was observed between the materials. The power conversion efficiency (PCE), open-circuit voltage (Voc), short-circuit current (Jsc), and fill factor (FF) recorded for the fabricated electrodes were 0.19%, 0.354 V, 2.386 mA/cm2, and 0.23 for Cu(II)Nfs@CFS, and 1.08%, 0.639 V, 3.909 mA/cm2, and 0.43 for Cu(II)Nfs/MWCNTs@CFS, respectively. It is notable that the PCE values increased by fivefold, and the immobilization process contributed to the improved Voc, Jsc, and FF values. With different modifications of such materials, it will be possible to design DSSC devices with higher performance in the future. Graphical Abstract: [Figure not available: see fulltext.]